Transactions on Machine Intelligence

Transactions on Machine Intelligence

Effect of Grading Index on The Stress Response of a Rotating FGM Hollow Cylinder with Functionally Graded Piezoelectric Layers

Document Type : Original Article

Authors
M. Saadatfar 1
Y. Bik Iravani 2
W.T. Saleh 2
I. K. I. Al-hamadani 2
K.H. Ayish 2
1 Associate Prof. of Mechanical Engineering, Department of Mechanical Engineering, University of Qom, Qom, Iran
2 MSc. Student of Mechanical Engineering Department of Mechanical Engineering, University of Qom, Qom, Iran
10.47176/TMI.2022.210
Abstract
This study presents a comprehensive analytical investigation into the thermo-electro-elastic response of a rotating long hollow cylinder composed of a functionally graded material (FGM), with radially polarized functionally graded piezoelectric material (FGPM) layers perfectly bonded to its inner and outer surfaces. The cylinder is subjected to simultaneous thermal, electrical, and mechanical loadings, providing a realistic simulation of operational conditions in advanced electromechanical systems. The material properties of both the FGM cylinder and the FGPM layers are assumed to vary continuously along the radial direction according to a power-law distribution, while Poisson’s ratio remains constant in the FGM region. The structure is analyzed under steady-state conditions while rotating at a constant angular velocity around its central axis. Closed-form analytical expressions are derived for the radial displacement, stress components, and electric potential using the theory of elasticity and electro-mechanics. The results are validated through parametric studies that explore the effects of key variables such as the material gradation index, angular velocity, thickness ratio, applied electrical voltage, and boundary temperatures. Numerical simulations illustrate how these parameters influence the stress distribution and overall structural behavior. The findings offer valuable design insights for advanced smart structures and rotating piezoelectric devices, emphasizing the importance of functional grading in enhancing mechanical integrity and electromechanical coupling performance under complex operational environments.
Keywords
Grading Index
Functionally Graded Piezoelectric
Long Hollow Cylinder
Stress Distribution
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Transactions on Machine Intelligence
Volume 5, Issue 3
Summer 2022
Pages 210-221

  • Receive Date 10 June 2022
  • Revise Date 29 August 2022
  • Accept Date 29 September 2022